HAL4SDV at EFECS2025
On the 3-4 December, 2025, HAL4SDV project was presented at EFECS 2025, the key European event for electronic components, embedded systems, and digital innovation. The project pitch, given by Andreas Eckel from TTTech highlighted the project’s mission to deliver a unified Hardware Abstraction Layer that enables safe, secure, and scalable development for software-defined vehicles.
Project partners gathered on-site, contributing to insightful discussions on the future of automotive architectures, interoperability challenges, and Europe’s path toward more flexible vehicle software ecosystems. The exchange with aligned initiatives further strengthened collaborative opportunities across the SDV landscape.
EFECS 2025, Europe’s key event for electronic components, systems, and semiconductors, brought together around 700 policymakers, industry leaders, and researchers from across Europe, reaffirming its role as a key platform for shaping Europe’s electronic components and systems agenda. Discussions throughout the event focused on translating strategic ambition into concrete outcomes through coordinated action across research, innovation, and industry.
The central themes of EFECS 2025 - Europe’s decision to pursue a distinct strategic path, the tangible progress being made under the EU Chips Act, and the growing importance of collaboration across the value chain.
©HAL4SDV
HAL4SDV receives funding within the Chips Joint Undertaking (Chips JU) - the Public-Private Partnership for research, development and innovation under Horizon Europe – and National Authorities under grant agreement n° 101139789.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.
